| Item | Mass Production | Small Batch Production | ||
| Number of layers | UP to16L | UP to 30L | ||
| Material Types | FR-4, Halogen free, High TG, Cem-3, PTFE, Aluminum BT, Rogers | |||
| Maximum board size | 610*460mm | 762*508mm | ||
| Board thickness | 0.3-3.5mm | 0.21-6.0mm | ||
| Minimum line width/space | 0.1/0.1mm | 0.076/0.076mm | ||
| Minimum line gap | +/-15% | +/-10% | ||
| Outer layer copper thickness | 140um | 245um | ||
| Inner layer copper thickness | 70um | 245um | ||
| Min.finished hole size(mechanical) | 0.2mm | 0.15mm | ||
| Min.finished hole size (laser hole) | 0.1mm | 0.1mm | ||
| Aspect ratio | 10:01 | 20:01 | ||
| Solder mask color | Green、Blue、Black、White、Yellow、Red、Grey | |||
| Impedance control tolerance | <=+/-10% | |||
| Surface Treatment | Flash gold | 0.025-0.075um | 0.025-0.5um | |
| Immersion gold | 0.05-0.1um | 0.1-0.2um | ||
| Sn/Pb HASL | 1-70um | |||
| Leadfree HASL | 1-70um | |||
| Immersion silver | 0.08-0.3um | |||
| OSP(Entek) | 0.2-0.4um | |||
| Gold finger | 0.375um<x<1.75um | >=1.75um | ||
| Hard gold plating | 0.375um<x<1.75um | >=1.75um | ||
| Immsion Sn | 0.8um<x<=1.20um | |||
| V-Cut | V-Cut degree | 20,30,45,60 | ||
| Outline Profile | Chamfer | The angle type of the chamfer | 30,45,60 | |
| Plug via hole | Max.size can be plugged | 0.6mm | 0.7mm | |
| Largest NPTH hole size | 6.5mm | >6.5mm | ||
| Largest PTH hole size | 6.5mm | >6.5mm | ||
| Min.annular ring can be kept | 0.15mm | 0.1mm | ||
| Min.distance between the IC | 0.25mm | 0.18mm | ||
| pads can keep Sm bridge | ||||
| Min.SM bridge for green soldermask | 0.1mm | 0.076mm | ||
| Min.SM bridge for black soldermask | 0.125mm | 0.1mm | ||
| Tolerance of dimension size | <=+/-0.13mm | +/-0.1mm | ||
| Tolerance of board thickness | >=1.0mm +/-10% | +/-8% | ||
| <1.0mm +/-0.1mm | ||||
| Tolerance of finished NPTH hole size | +/-0.05mm | +/-0.05mm | ||
| Tolerance of finished PTH hole size | +/-0.076mm | +/-0.05mm | ||
| Delivery time | 10~12D | 5~7D | ||
| Capacity | 60000sq/m | |||
| CAM capability | 20 items | 100-180 items | ||
| Item | Description | PCBA Capability |
| File Formats | Gerber files | 274-X,274-D, DXF, … |
| BOM (Bill of Materials) | Excel(preferred), PDF | |
| Pick and Place file (XYRS) | X & Y coordinates | |
| Board type | Board types for assembly | Rigid, Flexible, Rigid-Flex |
| Board Size | Minimum and Maximum | Smallest size: 2.0” x 2.0”, 50mm x 50mm,Largest size: 19.7” x 19.7”, 500mm x 500mm |
| Solder paste printing | Max stencil size | 1560mm x 450mm |
| Pick and Place | Min. SMT part package | 201 |
| Min. IC pitch | 0.3mm | |
| Min.chip size | 01 005 | |
| QFP lead pitch | 0.38mm to 2.54mm | |
| BGA capability | BGA ball pitch | 0.5mm to 3.00 mm |
| BGA ball size | 0.4mm to 1.0mm | |
| Reballing and Rework (De-population and Re-population) | ||
| Reflow | Optimized Reflow Profiling and multi-zone temperature control | |
| Wave flow | temperature control and tooling | |
| Assembly | Press Fit Connectors | Yes |
| Mechanical Assembly and Box Builds | Yes | |
| Cable & Harness Assembly | Yes | |
| Rework | De-population and Re-population | Yes |
| Fine Pitch | Yes | |
| Cuts & Jumps | Yes | |
| Minor PCB Repair | Yes | |
| Wash | De-ionized Wash | Yes |
| Testing | Visual Inspection | Yes |
| AOI (Automated Optical Inspection) | Yes | |
| ICT (In Circuit Test) | Yes | |
| X-Ray | Yes | |
| Functional Test | Yes | |
| Firmware loading | Yes | |
| Lead time | 4-6 weeks | |
Millions of circuit boards are produced here every year, which provides superior service for automotive electronics, medical electronics, power communications, industrial automation, intelligent home and other industries around the world.
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